Products & Services

Power/Discrete Packages

Other Services

Wafer Backgrind

›  5 inch up to 8 inch wafer diameter grinding down to 7-mil final wafer thickness

Wafer Probe

› up to 6 inch diameter capability

› parallel testing

Wafer Sort

› up to 6 inch diameter capability

› 2-bin capability film frame output

Wafer Saw

›  single/double mesa construction

› standard cut square/special cut hexagonal

› flip frame output

Wafer Plate

› 10x to 100x inspection capability

› waffle/vial pack