Capabilities Package 2.8 - 3.04 mm 1.20 - 1.40 mm 0.95 - 1.0 mm
Die Pad 68 x 41 mils / 35 x 34 mils-Dual Pad
Materials L/F CDA194 1/2H
DA Epoxy
No. of Die Single / Dual Die
WB Au
Wire Size 1 - 1.3 mils
Mold Sumikon EME G600/ Sumikon EME G710S
Leadfinish 100% Tin (ROHS) / Solder Plate
Packaging Tape & Reel / Bulk
Thermal Resistance Donec Pede justo Nullam dictum felis eu pede
Donec Pede justo Nullam dictum felis eu pede
Donec Pede justo Nullam dictum felis eu pede
Electrical Performance Donec Pede justo Nullam dictum felis eu pede
Donec Pede justo Nullam dictum felis eu pede
Donec Pede justo Nullam dictum felis eu pede
Product Application Donec Pede justo Nullam dictum felis eu pede
Donec Pede justo Nullam dictum felis eu pede
Donec Pede justo Nullam dictum felis eu pede